Materion Introduces New Chemical Deposition Removal
The innovative cleaning approach chemically removes deposition materials and surface contaminants from copper without the use of aggressive mechanical processes. This technology offers multiple advantages as it minimizes harm and extends the useful life of expensive copper parts within the customers' deposition chamber.
"Chemical cleaning of copper parts is a huge advancement over
conventional means," commented
Cleaning Copper Parts
Physical vapor deposition is a process that coats products with thin
layers of precious or non-precious metal. During PVD, the vacuum chamber
and surrounding components are impacted and become coated with
depositions such as gold, titanium, nickel, copper, platinum or other
high-value metals. In order to recover as much valuable metal deposition
as possible for the customer, several methods can be employed.
Mechanical removal, while generally employed, is not recommended for
copper parts as it can harm the underlying copper. Other traditional
Therefore, to solve the problem of potential harm from these methods,
To maximize effectiveness, Materion's chemical cleaning method is tailored toward the customer's particular deposition and/or substrate material. In addition, customized surface treatments and part texturization after cleaning are also available. This new copper parts cleaning technology and other traditional precision parts cleaning processes are offered at all of Materion's worldwide cleaning locations.
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